CLOSE

Leading Optical Chip and Module Manufacturers Target 40 Gbit/s Solution with an Optical Device (XLMD) MSA

Anaheim, Ca., March 26, 2007 – Eudyna Devices Inc., Mitsubishi Electric Corp., NEC Electronics Corp., Oki Electric Industry Co., Ltd., Opnext, Inc. and Sumitomo Electric Industries, Ltd., today announced at OFC/NFOEC 2007 the formation of a Multi-Source Agreement (MSA) for compatible sources of optical transmitter and receiver devices for use in 40 Gbit/s optical transceiver modules. This initiative, created in response to an increase in projected demand, specifies the common mechanical dimensions, footprint, pin functions and performance of the optical transmitter and receiver devices; key compact optical components used in 40 Gbit/s optical transceiver modules.

"This agreement will help support the emergence of the 40 Gbit/s compact module market, providing advanced solutions to high capacity network and storage systems," said the MSA Committee. “In the long term, all members will consolidate their current models into MSA compliant products in order to achieve consistent customer delivery and market growth.”

In order to construct the broadband internetworking infrastructure, 10 Gbit/s optical transmission interfaces are widely deployed in Metropolitan Area Network (MAN), Local Area Network (LAN) and Storage Area Network (SAN). 40 Gbit/s optical transmission interfaces are currently being used within the industry. The 10 Gbit/s interfaces, TOSA and ROSA devices, that were made compatible among manufacturers through a 10 Gbit/s Miniature Device Multi-Source Agreement (XMD-MSA), have been supplied and widely recognized as the industry standard. Subsequently, those companies involved in 40 Gbit/s optical interfaces, the six chip and module manufactures, formed an MSA for optical devices for quick development and the ease of component procurement for optical transceiver modules.

The new MSA defines the external-modulation laser transmitter devices and the PIN Photodiode - Trans-impedance amplifier (PIN-TIA) receiver devices that comply with 40 Gbit/s interface standard of OC-768. The MSA targets transmission modules for up to 2km applications.

This MSA intends to establish the compatible optical devices as defined below:
(1) Common mechanical dimensions
(2) Common interface with common PCB design of 40 Gbit/s optical transceiver modules
(3) Common pin assignment and functions
(4) Common electrical and optical characteristics

The MSA Committee plans to release the specifications for pigtail type optical devices within 2007 and to finalize TOSA/ROSA specifications in step in accordance with the future standardization of pluggable optical transceivers.

CLOSE

CLOSE

Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/s Solutions Based on XLMD Optical Device Multi-Source Agreement

Multi-Source Agreement Enables Multiple Vendors to Produce 40 Gbit/s Optical Devices Based on a Unified Standard

TOKYO, JAPAN & SAN DIEGO, CA: February 21, 2008 – Eudyna Devices Inc., Mitsubishi Electric Corp., NEC Electronics Corp., Oki Electric Industry Co., Ltd., Opnext Inc. and Sumitomo Electric Industries, Ltd., today announced, in advance of OFC/NFOEC, common specifications for pigtail type optical devices based on the 40 Gbit/s Optical Device Multi-Source Agreement (XLMD-MSA^*1), introduced by the six companies in March 2007.

The newly available XLMD-MSA specifications detail the external-modulation laser transmitter devices with built-in driver ICs and the PIN-TIA^*2 receiver devices that comply with 40 Gbit/s interface standard for SONET OC-768^*3.

10 Gbit/s optical transmission interfaces are widely deployed in Metropolitan Area Networks (MAN), Local Area Networks (LAN) and Storage Area Networks (SAN). These networks currently form the backbone of broadband infrastructure, consequently increasing the popularity of 40 Gbit/s optical transmission interfaces. The XLMD-MSA aims to establish compatible sources of 40 Gbit/s optical transmitter and receiver devices embedded into the 40 Gbit/s optical transceiver modules. This agreement will accelerate the growth of the 40 Gbit/s transceiver module market, providing advanced solutions to high capacity network and storage systems. All members will promote the MSA-compliant products in order to achieve consistent customer delivery and market growth.

The XLMD-MSA specifications for compatible optical devices include:
.. Mechanical dimensions and pin assignments of pigtail type optical devices
> .. High speed electrical interface using a dual SMPM^*4 connectors
.. Optical and electrical characteristics

The specifications are now available at the XLMD-MSA web site.
URL : http://www.xlmdmsa.org/

In accordance with the future standardization of 40Gbit/s pluggable optical transceivers, the XLMD-MSA committee will continue to discuss the corresponding optical device specifications.

Notes:
1) XLMD-MSA: 40Gbit/s Miniature Device Multi Source Agreement among Eudyna Devices Inc., Mitsubishi Electric Corp., NEC Electronics Corp., Oki Electric Industry Co., Ltd., Opnext Inc. and Sumitomo Electric Industries, Ltd, effective from March 2007.
2) PIN-TIA: PIN photodiode with a trans-impedance amplifier.
3) SONET OC-768: SONET is synchronous optical networking. OC-768 is a network line with 40Gbit/s transmission rate.
4) SMPM: Small-sized coaxial connectors specified in MIL-STD-348A, such as GPPO^TM. GPPO is a trademark of Corning Gilbert Inc.

CLOSE